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3D Printing System With Waste Collection Subsystem
Copyright © Targeted News Service, 2024
2024-03-26
ALEXANDRIA, Virginia, March 26 -- 3D SYSTEMS, INC., Rock Hill, South Carolina has been assigned a patent (No. US 11938679 B2, initially filed June 24, 2022) developed by Andrew Enslow, Escondido, California, and Darold Tejero Lazatin, San Marcos, California, for "3D printing system with waste collection subsystem." . . .

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