Sunday - April 14, 2024
3D Printing System With Waste Collection Subsystem
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ALEXANDRIA, Virginia, March 26 -- 3D SYSTEMS, INC., Rock Hill, South Carolina has been assigned a patent (No. US 11938679 B2, initially filed June 24, 2022) developed by Andrew Enslow, Escondido, California, and Darold Tejero Lazatin, San Marcos, California, for "3D printing system with waste collection subsystem." . . .

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