3D Semiconductor Apparatus Manufactured With a Plurality of Substrates and Method of Manufacture Thereof
Copyright © Targeted News Service, 2023
2023-03-21
Copyright © Targeted News Service, 2023
2023-03-21
ALEXANDRIA, Virginia, March 21 -- TOKYO ELECTRON LIMITED, Tokyo, Japan has been assigned a patent (No. US 11610993 B2, initially filed Oct. 2, 2020) developed by Mark I. Gardner, Cedar Creek, Texas, and H. Jim Fulford, Marianna, Florida, for "3D semiconductor apparatus manufactured with a plurality of substrates and method of manufacture thereof." . . .