Thursday - November 5, 2026

Systems and Methods for AI-based Multi-Dimensional Modulation Shaping

2026-11-03

ALEXANDRIA, Virginia, Nov. 3 -- SAMSUNG ELECTRONICS COMPANY, LTD., Suwon City, South Korea has been assigned a patent (No. US 12786036 B2, initially filed July 15, 2024) developed by Nuwan Suresh Ferdinand, Stittsville, Canada, and Sanjeewa Herath, Ottawa, Canada, for "Systems and methods for AI-based multi-dimensional modulation shaping." . . .

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Systems and Methods for AI-based Multi-Dimensional Modulation Shaping

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