Wednesday - October 14, 2026

LED Circuit Board Structure, LED Testing and Packaging Method and LED Pixel Package

2026-10-13

ALEXANDRIA, Virginia, Oct. 13 -- INGENTEC CORPORATION, Miaoli County, Taiwan has been assigned a patent (No. US 12765125 B2, initially filed Nov. 21, 2022) developed by three inventors Yi-Chuan Huang, Miaoli County, Taiwan; Hsiao-Lu Chen, Miaoli County, Taiwan; and Ai-Sen Liu, Miaoli County, Taiwan, for "LED circuit board structure, LED testing and packaging method and LED pixel package." . . .

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LED Circuit Board Structure, LED Testing and Packaging Method and LED Pixel Package

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