Monday - October 26, 2026

Wafer-Level Hybrid Bonded RF Switch With Redistribution Layer

2026-10-06

ALEXANDRIA, Virginia, Oct. 6 -- QORVO US, INC., Greensboro, North Carolina has been assigned a patent (No. US 12757792 B2, initially filed Oct. 26, 2023) developed by six inventors Michael Carroll, Jamestown, North Carolina; Eric K. Bolton, Kernersville, North Carolina; Ma Shirley Asoy, High Point, North Carolina; Xi Luo, High Point, North Carolina; Daniel Charles Kerr, Oak Ridge, North Carolina; and Chi-Hsien Chiu, High Point, North Carolina, for "Wafer-level hybrid bonded RF switch with redis . . .

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Wafer-Level Hybrid Bonded RF Switch With Redistribution Layer

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