Wednesday - September 30, 2026

AI Enabled 3D Printing for Controlled Microstructure Through Insulation Integration

2026-09-29

ALEXANDRIA, Virginia, Sept. 29 -- INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, New York has been assigned a patent (No. US 12746727 B2, initially filed July 26, 2024) developed by four inventors Tushar Agrawal, West Fargo, North Dakota; Sarbajit Kumar Rakshit, Kolkata, India; Carolina Garcia Delgado, Zapopan, Mexico; and Martin G. Keen, Cary, North Carolina, for "AI enabled 3D printing for controlled microstructure through insulation integration." . . .

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AI Enabled 3D Printing for Controlled Microstructure Through Insulation Integration

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