Wednesday - September 23, 2026

Single Axis Conductive Flexible Printed Circuit Board Stiffener

2026-09-22

ALEXANDRIA, Virginia, Sept. 22 -- SESAME AI, INC., Los Angeles, California has been assigned a patent (No. US 12745345 B1, initially filed Sept. 22, 2025) developed by Brian Scott Lau, Bellevue, Washington, and Matthew DeVoe, Bellevue, Washington, for "Single axis conductive flexible printed circuit board stiffener." . . .

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Single Axis Conductive Flexible Printed Circuit Board Stiffener

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