Monday - October 26, 2026

Multichip Module Thermal Management Through Backside Metal

2026-09-08

ALEXANDRIA, Virginia, Sept. 8 -- QORVO US, INC., Greensboro, North Carolina has been assigned a patent (No. US 12733519 B2, initially filed March 24, 2023) developed by five inventors MD Hasnine, Richardson, Texas; Mark C. Woods, Richardson, Texas; Neftali Salazar, Oak Ridge, North Carolina; Smreeti Dahariya, Chapel Hill, North Carolina; and Christine Blair, Lewisville, Texas, for "Multichip module thermal management through backside metal." . . .

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Multichip Module Thermal Management Through Backside Metal

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