Sunday - October 4, 2026

Selective Removal of Adhesive From Coverlay for Printed Circuit Board Insulation

Copyright © Targeted News Service 2026
2026-08-25
ALEXANDRIA, Virginia, Aug. 25 -- ROCKWELL COLLINS, INC., Cedar Rapids, Iowa has been assigned a patent (No. US 12720671 B2, initially filed Jan. 9, 2024) developed by John A. Bauer, Marion, Iowa, and Robert C. Cooney, Janesville, Wisconsin, for "Selective removal of adhesive from coverlay for printed circuit board insulation." . . .

Information Request Form

Name:
Category that best fits the type
of business or agency you are
affiliated with:		 Government Newspaper / Media Business
Public Policy Individual / Student Educators
Company Name:
Email:
Phone:
State:
I'd like to have a copy of this article mailed to me.
To also receive a free sample of other Targeted News products check the appropriate boxes below.
Golf Handicap site (FairwayFiles.com)
Products marked with ** can be customized by keywords or areas of interest.
If you select them please specify your keywords in the box below:
If we need to contact you please specify your preferred contact method.
Have a representative contact me by phone
Have a representative contact me via email

Additonal questions or comments:

Click here for more information or a free trial

Copyright Targeted News Service 2026