Thursday - August 27, 2026

Heat Transfer Machine Mold for Badge Pattern

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2026-08-25
ALEXANDRIA, Virginia, Aug. 25 -- HUNAN SIJIU TECHNOLOGY CO., LTD., Changsha, China has been assigned a design patent (No. US D1144468 S1, initially filed Aug. 8, 2025) developed by Wenxiong Huang, Changsha, China, and Min Ai, Changsha, China, for "Heat transfer machine mold for badge pattern." . . .

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