Sunday - October 4, 2026

Systems for Integrated Decomposition and Scanning of a Semiconducting Wafer

2026-08-18

ALEXANDRIA, Virginia, Aug. 18 -- ELEMENTAL SCIENTIFIC, INC., Omaha, Nebraska has been assigned a patent (No. US 12713869 B2, initially filed June 1, 2023) developed by eight inventors Tyler Yost, Omaha, Nebraska; Daniel R. Wiederin, Omaha, Nebraska; Beau A. Marth, La Vista, Nebraska; Jared Kaser, Fort Collins, Colorado; Jonathan Hein, Elkhorn, Nebraska; Jae Seok Lee, Burford, Georgia; Jae Min Kim, Gyeonggi-do, South Korea; and Stephen H. Sudyka, Omaha, Nebraska, for "Systems for integrated deco . . .

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Systems for Integrated Decomposition and Scanning of a Semiconducting Wafer

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