Thursday - August 20, 2026

Heat Transfer Machine Mold Assembly for Badge Pattern

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2026-08-18
ALEXANDRIA, Virginia, Aug. 18 -- HUNAN SIJIU TECHNOLOGY CO., LTD., Changsha, China has been assigned a design patent (No. US D1142541 S1, initially filed Aug. 8, 2025) developed by Wenxiong Huang, Changsha, China, and Min Ai, Changsha, China, for "Heat transfer machine mold assembly for badge pattern." . . .

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