Thursday - August 20, 2026

HBM Silicon Photonic TSV Architecture for Lookup Computing AI Accelerator

2026-08-18

ALEXANDRIA, Virginia, Aug. 18 -- SAMSUNG ELECTRONICS CO., LTD., , South Korea has been assigned a patent (No. US 12713976 B2, initially filed July 25, 2022) developed by three inventors Peng Gu, Santa Barbara, California; Krishna Malladi, San Jose, California; and Hongzhong Zheng, Los Gatos, California, for "HBM silicon photonic TSV architecture for lookup computing AI accelerator." . . .

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HBM Silicon Photonic TSV Architecture for Lookup Computing AI Accelerator

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