Cooling Interface for a Pluggable Module
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2026-08-18
ALEXANDRIA, Virginia, Aug. 18 -- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, Texas has been assigned a patent (No. US 12713561 B2, initially filed Feb. 29, 2024) developed by three inventors Harvey John Lunsman, Chippewa Falls, Wisconsin; Michael Dustin Scott, Chippewa Falls, Wisconsin; and Ernesto J. Ferrer, Aguadilla, Puerto Rico, for "Cooling interface for a pluggable module." . . .
