Wednesday - September 2, 2026

Bonding Layer Between Stacked Integrated Circuits

2026-08-04

ALEXANDRIA, Virginia, Aug. 4 -- HONEYWELL INTERNATIONAL INC., Charlotte, North Carolina has been assigned a patent (No. US 12701773 B2, initially filed April 12, 2023) developed by three inventors James L. Tucker, Clearwater, Florida; Eric E. Vogt, Independence, Minnesota; and James W Karcz, Jr., Plymouth, Minnesota, for "Bonding layer between stacked integrated circuits." . . .

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Bonding Layer Between Stacked Integrated Circuits

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