Wednesday - September 2, 2026

Laplace Noise Enabled Encapsulation for Smart Bi-Directional Dual Node Hashchain Based Remodeled Data Clean Room Bundles

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2026-08-04
ALEXANDRIA, Virginia, Aug. 4 -- BANK OF AMERICA CORPORATION, Charlotte, North Carolina has been assigned a patent (No. US 12700999 B2, initially filed Aug. 6, 2024) developed by three inventors Sakshi Bakshi, New Delhi, India; Sneha Padiyar, East Mumbai, India; and Hariharan Balakrishnan, Chennai, India, for "Laplace noise enabled encapsulation for smart bi-directional dual node hashchain based remodeled data clean room bundles." . . .

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