Substrate With Integrated Multi-Layer Pouch/Pocket
Copyright © Targeted News Service 2026
2026-07-28
ALEXANDRIA, Virginia, July 28 -- STABULUM GROUP, LLC, Ames, Iowa has been assigned a patent (No. US 12690697 B1, initially filed July 22, 2024) developed by four inventors Trung Lo Deo, Urbandale, Iowa; Cameron James Lynch, Iowa City, Iowa; Okaydo Van Duong, Des Moines, Iowa; and James Edward Fay, Boulder, Colorado, for "Substrate with integrated multi-layer pouch/pocket." . . .
