Wednesday - September 2, 2026

Mounting Arrangements for Semiconductor Packages and Related Methods

2026-07-28

ALEXANDRIA, Virginia, July 28 -- CREELED, INC., Durham, North Carolina has been assigned a patent (No. US 12696593 B2, initially filed March 25, 2022) developed by five inventors Timothy Ling, Raleigh, North Carolina; Ryan Mohn, Mebane, North Carolina; David N. Randolph, Wake Forest, North Carolina; David Peoples, Raleigh, North Carolina; and Wooh Jae Kim, Cary, North Carolina, for "Mounting arrangements for semiconductor packages and related methods." . . .

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Mounting Arrangements for Semiconductor Packages and Related Methods

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