Wednesday - July 29, 2026

Hot Melt Adhesive

2026-07-28

ALEXANDRIA, Virginia, July 28 -- HENKEL AG & CO., KGAA, Duesseldorf, Germany has been assigned a patent (No. US 12692421 B2, initially filed June 1, 2023) developed by Ai Takamori, Osaka, Japan, for "Hot melt adhesive." . . .

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