Wednesday - July 22, 2026

Via Formed in a Wafer Using a Front-Side and a Back-Side Process

2026-07-21

ALEXANDRIA, Virginia, July 21 -- CELESTIAL AI INC., Santa Clara, California has been assigned a patent (No. US 12690438 B2, initially filed July 3, 2023) developed by Ankur Aggarwal, Pleasanton, California, and Jeremy Matthew Plunkett, San Jose, California, for "Via formed in a wafer using a front-side and a back-side process." . . .

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Via Formed in a Wafer Using a Front-Side and a Back-Side Process

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