Wednesday - July 15, 2026

Semiconductor Package and Method for Marking a Semiconductor Package

2026-07-14

ALEXANDRIA, Virginia, July 14 -- INFINEON TECHNOLOGIES AUSTRIA AG, Villach, Austria has been assigned a patent (No. US 12685179 B2, initially filed April 20, 2023) developed by five inventors Hwee Yin Low, Bukit Beruang, Malaysia; Badrus Hisham Abdul Rani, Muar Johor, Malaysia; Wee Aun Jason Lim, Melaka, Malaysia; Ai Yun Loh, Melaka Tengah, Malaysia; and Muhamad Hairul Fauzi Wahid, Melaka Tengah, Malaysia, for "Semiconductor package and method for marking a semiconductor package." . . .

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Semiconductor Package and Method for Marking a Semiconductor Package

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