Wednesday - September 2, 2026

Delamination/Cracking Improvement at Solder Joints in Microelectronics Package

2026-07-14

ALEXANDRIA, Virginia, July 14 -- QORVO US, INC., Greensboro, North Carolina has been assigned a patent (No. US 12685205 B2, initially filed March 21, 2023) developed by three inventors Yinbao Yang, Allen, Texas; Xiaokang Huang, Plano, Texas; and Kenneth Frazee, Orlando, Florida, for "Delamination/cracking improvement at solder joints in microelectronics package." . . .

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Delamination/Cracking Improvement at Solder Joints in Microelectronics Package

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