Wednesday - July 15, 2026

AI Bonding Wire for Semiconductor Devices

2026-07-14

ALEXANDRIA, Virginia, July 14 -- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, Japan has been assigned a patent (No. US 12685206 B2, initially filed Jan. 31, 2022) developed by six inventors Yuya Suto, Tokyo, Japan; Tomohiro Uno, Tokyo, Japan; Tetsuya Oyamada, Tokyo, Japan; Daizo Oda, Saitama, Japan; Motoki Eto, Saitama, Japan; and Yuto Kurihara, Saitama, Japan, for "AI bonding wire for semiconductor devices." . . .

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AI Bonding Wire for Semiconductor Devices

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