Sunday - October 4, 2026

Wrapping Perovskite Grains With Silica Shells for Improved Stability and Efficiency of Perovskite Electronic Devices

2026-07-07

ALEXANDRIA, Virginia, July 7 -- NUTECH VENTURES, Lincoln, Nebraska has been assigned a patent (No. US 12677581 B2, initially filed Dec. 10, 2019) developed by Jinsong Huang, Lincoln, Nebraska, and Yang Bai, Westlake, Australia, for "Wrapping perovskite grains with silica shells for improved stability and efficiency of perovskite electronic devices." . . .

Information Request Form

Name:
Category that best fits the type of business or agency you are affiliated with:	Government Newspaper / Media Business Public Policy Individual / Student Educators
Company Name:
Email:
Phone:
State:

I'd like to have a copy of this article mailed to me.

To also receive a free sample of other Targeted News products check the appropriate boxes below.
Golf Handicap site (FairwayFiles.com)
Products marked with ** can be customized by keywords or areas of interest. If you select them please specify your keywords in the box below:

If we need to contact you please specify your preferred contact method. Have a representative contact me by phone
Have a representative contact me via email

Additonal questions or comments:

Click here for more information or a free trial

Existing Customer Login

Wrapping Perovskite Grains With Silica Shells for Improved Stability and Efficiency of Perovskite Electronic Devices

Information Request Form

Copyright Targeted News Service 2026