Stacked Die Package and Methods of Forming the Same
Copyright © Targeted News Service 2026
2026-06-23
ALEXANDRIA, Virginia, June 23 -- QORVO US, INC., Greensboro, North Carolina has been assigned a patent (No. US 12667009 B2, initially filed Nov. 17, 2022) developed by Julio C. Costa, Oak Ridge, North Carolina, and Robert L. Sowell, III, Greensboro, North Carolina, for "Stacked die package and methods of forming the same." . . .
