Wednesday - June 17, 2026

Light-Emitting Diode Package Structure and Manufacturing Method Thereof

2026-06-16

ALEXANDRIA, Virginia, June 16 -- INGENTEC CORPORATION, Miaoli County, Taiwan has been assigned a patent (No. US 12660396 B2, initially filed Sept. 22, 2023) developed by four inventors Ai-Sen Liu, Miaoli County, Taiwan; Hsiao-Lu Chen, Miaoli County, Taiwan; Yi-Chuan Huang, Miaoli County, Taiwan; and Hsiang-An Feng, Miaoli County, Taiwan, for "Light-emitting diode package structure and manufacturing method thereof." . . .

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Light-Emitting Diode Package Structure and Manufacturing Method Thereof

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