Wednesday - June 3, 2026

Integrated Machining Device for Grinding and Polishing Diamond and Method Thereof

2026-06-02

ALEXANDRIA, Virginia, June 2 -- HUAQIAO UNIVERSITY, Quangzhou City, China has been assigned a patent (No. US 12643191 B2, initially filed June 30, 2023) developed by five inventors Jing Lu, Xiamen City, China; Hailang Wen, Xiamen City, China; Qiufa Luo, Xiamen City, China; Chen Li, Xiamen City, China; and Tengfeng Ai, Xiamen City, China, for "Integrated machining device for grinding and polishing diamond and method thereof." . . .

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Integrated Machining Device for Grinding and Polishing Diamond and Method Thereof

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