Tuesday - June 9, 2026

RF Amplifier Devices and Methods of Manufacturing Including Modularized Designs With Flip Chip Interconnections and Integration Into Packaging

2026-06-02

ALEXANDRIA, Virginia, June 2 -- WOLFSPEED, INC., Durham, North Carolina has been assigned a patent (No. US 12647083 B2, initially filed June 14, 2023) developed by three inventors Alexander Komposch, Morgan Hill, California; Eng Wah Woo, Ipoh, Malaysia; and Basim Noori, San Jose, California, for "RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections and integration into packaging." . . .

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RF Amplifier Devices and Methods of Manufacturing Including Modularized Designs With Flip Chip Interconnections and Integration Into Packaging

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