Tuesday - June 9, 2026

Solder Alloy, Solder Paste, Solder Ball, Resin Flux-Cored Solder and Solder Joint

Copyright © Targeted News Service 2026
2026-05-26
ALEXANDRIA, Virginia, May 26 -- SENJU METAL INDUSTRY CO., LTD., Tokyo, Japan has been assigned a patent (No. US 12636738 B2, initially filed Dec. 21, 2018) developed by five inventors Takahiro Yokoyama, Saitama, Japan; Kanta Dei, Tokyo, Japan; Takahiro Matsufuji, Tokyo, Japan; Hikaru Nomura, Tokyo, Japan; and Shunsaku Yoshikawa, Tokyo, Japan, for "Solder alloy, solder paste, solder ball, resin flux-cored solder and solder joint." . . .

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