Wednesday - May 20, 2026

Wire Bonding Machine Having a Rotatable Capillary to Secure a Bond Wire to a Connection Point

2026-05-19

ALEXANDRIA, Virginia, May 19 -- SANDISK TECHNOLOGIES, INC., Milpitas, California has been assigned a patent (No. US 12635080 B2, initially filed Jan. 11, 2024) developed by nine inventors Jingyun Chen, Shanghai, China; Fen Yu, Shanghai, China; Guangqiang Li, Shanghai, China; Pengchen Ai, Shanghai, China; Fuqiang Xiao, Shanghai, China; Shujun Zheng, Shanghai, China; Yuan Ming, Shanghai, China; Sizhe Yue, Shanghai, China; and Lian Chen, Shanghai, China, for "Wire bonding machine having a rotatabl . . .

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Wire Bonding Machine Having a Rotatable Capillary to Secure a Bond Wire to a Connection Point

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