Wednesday - May 13, 2026

Encapsulation Process Method for Wafer-Level Light-Emitting Diode Dies

2026-05-12

ALEXANDRIA, Virginia, May 12 -- INGENTEC CORPORATION, Miaoli County, Taiwan has been assigned a patent (No. US 12628466 B2, initially filed May 19, 2023) developed by four inventors Ai-Sen Liu, Miaoli County, Taiwan; Hsiao-Lu Chen, Miaoli County, Taiwan; Yi-Chuan Huang, Miaoli County, Taiwan; and Hsiang-An Feng, Miaoli County, Taiwan, for "Encapsulation process method for wafer-level light-emitting diode dies." . . .

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Encapsulation Process Method for Wafer-Level Light-Emitting Diode Dies

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