Connector Assembly With Partitioning Assembly for Improved Airflow
Copyright © Targeted News Service 2026
2026-05-12
ALEXANDRIA, Virginia, May 12 -- MOLEX, LLC, Lisle, Illinois has been assigned a patent (No. US 12627086 B2, initially filed Oct. 24, 2023) developed by four inventors Hui-Hsuan Yang, New Taipei, Taiwan; Bhakteesh Arwankar, Uttara Kannada, India; Weiming Chen, Pleasanton, California; and Saiyed Muhammad Hasan Ali, Conway, Arkansas, for "Connector assembly with partitioning assembly for improved airflow." . . .
