Wednesday - April 1, 2026

Vertical Light Emitting Diode Die Packaging Method

2026-03-31

ALEXANDRIA, Virginia, March 31 -- INGENTEC CORPORATION, Zhunan Township, Taiwan has been assigned a patent (No. US 12593733 B2, initially filed Feb. 7, 2023) developed by three inventors Hsiao Lu Chen, Zhunan Township, Taiwan; Ai Sen Liu, Zhunan Township, Taiwan; and Hsiang An Feng, Zhunan Township, Taiwan, for "Vertical light emitting diode die packaging method." . . .

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Vertical Light Emitting Diode Die Packaging Method

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