Wednesday - March 25, 2026

3D Hybrid Bonding 3D Memory Devices With NPU/CPU for AI Inference Application

2026-03-24

ALEXANDRIA, Virginia, March 24 -- MACRONIX INTERNATIONAL CO., LTD., Hsinchu, Taiwan has been assigned a patent (No. US 12585931 B2, initially filed May 4, 2023) developed by Hsiang-Lan Lung, Ardsley, New York, for "3D hybrid bonding 3D memory devices with NPU/CPU for AI inference application." . . .

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3D Hybrid Bonding 3D Memory Devices With NPU/CPU for AI Inference Application

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