Tuesday - May 5, 2026

Solder Alloy, Solder Ball and Solder Joint

2026-03-24

ALEXANDRIA, Virginia, March 24 -- SENJU METAL INDUSTRY CO., LTD., Tokyo, Japan has been assigned a patent (No. US 12583060 B2, initially filed Nov. 17, 2021) developed by five inventors Yuki Iijima, Tokyo, Japan; Shunsaku Yoshikawa, Tokyo, Japan; Kanta Dei, Tokyo, Japan; Takahiro Matsufuji, Tokyo, Japan; and Kota Sugisawa, Tokyo, Japan, for "Solder alloy, solder ball and solder joint." . . .

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Solder Alloy, Solder Ball and Solder Joint

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