Friday - March 20, 2026

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder Joint

2026-03-17

ALEXANDRIA, Virginia, March 17 -- SENJU METAL INDUSTRY CO., LTD., Tokyo, Japan has been assigned a patent (No. US 12576463 B2, initially filed Feb. 8, 2021) developed by five inventors Yuuki Iijima, Tokyo, Japan; Shunsaku Yoshikawa, Tokyo, Japan; Takashi Saito, Tokyo, Japan; Kanta Dei, Tokyo, Japan; and Takahiro Matsufuji, Tokyo, Japan, for "Lead-free and antimony-free solder alloy, solder ball, and solder joint." . . .

Information Request Form

Name:
Category that best fits the type of business or agency you are affiliated with:	Government Newspaper / Media Business Public Policy Individual / Student Educators
Company Name:
Email:
Phone:
State:

I'd like to have a copy of this article mailed to me.

To also receive a free sample of other Targeted News products check the appropriate boxes below.
Golf Handicap site (FairwayFiles.com)
Products marked with ** can be customized by keywords or areas of interest. If you select them please specify your keywords in the box below:

If we need to contact you please specify your preferred contact method. Have a representative contact me by phone
Have a representative contact me via email

Additonal questions or comments:

Click here for more information or a free trial

Existing Customer Login

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder Joint

Information Request Form

Copyright Targeted News Service 2026