Saturday - March 21, 2026

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, in-Vehicle Electronic Circuit, ECU Electronic Circuit, in-Vehicle Electronic Circuit Device and ECU Electronic Circuit Device

2026-03-10

ALEXANDRIA, Virginia, March 10 -- SENJU METAL INDUSTRY CO., LTD., Tokyo, Japan has been assigned a patent (No. US 12569941 B2, initially filed June 18, 2024) developed by five inventors Shunsaku Yoshikawa, Tokyo, Japan; Takashi Saito, Tokyo, Japan; Yuuki Iijima, Tokyo, Japan; Kanta Dei, Tokyo, Japan; and Takahiro Matsufuji, Tokyo, Japan, for "Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circui . . .

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Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, in-Vehicle Electronic Circuit, ECU Electronic Circuit, in-Vehicle Electronic Circuit Device and ECU Electronic Circuit Device

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