Wednesday - March 11, 2026

Converting Processing Dimensions of a Wafer Package

2026-03-10

ALEXANDRIA, Virginia, March 10 -- CELESTIAL AI INC., Santa Clara, California has been assigned a patent (No. US 12571971 B2, initially filed April 1, 2025) developed by three inventors Ankur Aggarwal, Pleasanton, California; Anmol Rathi, San Jose, California; and Suresh Venkata Pothukuchi, Chandler, Arizona, for "Converting processing dimensions of a wafer package." . . .

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Converting Processing Dimensions of a Wafer Package

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