Wednesday - April 29, 2026

Double-Sided Integrated Circuit Module Having an Exposed Semiconductor Die

2026-02-24

ALEXANDRIA, Virginia, Feb. 24 -- QORVO US, INC., Greensboro, North Carolina has been assigned a patent (No. US 12564111 B2, initially filed May 8, 2024) developed by three inventors John Robert Siomkos, Greensboro, North Carolina; Edward T. Spears, Stokesdale, North Carolina; and Mark Crandall, Oak Ridge, North Carolina, for "Double-sided integrated circuit module having an exposed semiconductor die." . . .

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Double-Sided Integrated Circuit Module Having an Exposed Semiconductor Die

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