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Light-Emitting Diode Packages With Lead Frame Structures for Flip-Chip Mounting of Light-Emitting Diode Chips

2026-01-06

ALEXANDRIA, Virginia, Jan. 6 -- CREELED, INC., Durham, North Carolina has been assigned a patent (No. US 12520634 B2, initially filed May 31, 2022) developed by three inventors Guy Pickett, Durham, North Carolina; David Suich, Durham, North Carolina; and Colin Blakely, Raleigh, North Carolina, for "Light-emitting diode packages with lead frame structures for flip-chip mounting of light-emitting diode chips." . . .

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Light-Emitting Diode Packages With Lead Frame Structures for Flip-Chip Mounting of Light-Emitting Diode Chips

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