Monday - February 23, 2026

Methods for Dicing Semiconductor Wafers Having a Metallization Layer and Semiconductor Devices Made by the Methods

2026-01-06

ALEXANDRIA, Virginia, Jan. 6 -- WOLFSPEED, INC., Durham, North Carolina has been assigned a patent (No. US 12519017 B2, initially filed March 23, 2022) developed by Kevin Schneider, Cary, North Carolina, and Alexander Komposch, Morgan Hill, California, for "Methods for dicing semiconductor wafers having a metallization layer and semiconductor devices made by the methods." . . .

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Methods for Dicing Semiconductor Wafers Having a Metallization Layer and Semiconductor Devices Made by the Methods

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