Thursday - December 25, 2025

Systems and Methods for Testing Integrated Circuits Independent of Chip Package Configuration

2025-12-16

ALEXANDRIA, Virginia, Dec. 16 -- GLOBAL ETS, LLC, Odessa, Florida has been assigned a patent (No. US 12498416 B2, initially filed Oct. 26, 2023) developed by five inventors Stephen Saddow, Tampa, Florida; Cong Xu, Odessa, Florida; Feng Yu, Odessa, Florida; Liwei Xu, Odessa, Florida; and Yunghsiao Chung, Odessa, Florida, for "Systems and methods for testing integrated circuits independent of chip package configuration." . . .

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Systems and Methods for Testing Integrated Circuits Independent of Chip Package Configuration

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