Adhesive Circuit Patterning Process
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2025-12-02
ALEXANDRIA, Virginia, Dec. 2 -- JABIL INC., St. Petersburg, Florida has been assigned a patent (No. US 12490387 B2, initially filed Feb. 18, 2019) developed by LaiMing Lim, Penang, Malaysia, and Zambri Bin Samsudin, Penang, Malaysia, for "Adhesive circuit patterning process." . . .
