Tuesday - November 4, 2025

Method for Operating a Metal Drop Ejecting Three-Dimensional (3D) Object Printer to Form Vias in Printed Circuit Boards With Conductive Metal

Copyright © Targeted News Service 2025
2025-10-07
ALEXANDRIA, Virginia, Oct. 7 -- ADDITIVE TECHNOLOGIES LLC, Palm City, Florida has been assigned a patent (No. US 12439525 B2, initially filed May 17, 2023) developed by three inventors Denis Cormier, Pittsford, New York; Santokh S. Badesha, Pittsford, New York; and Varun Sambhy, Pittsford, New York, for "Method for operating a metal drop ejecting three-dimensional (3D) object printer to form vias in printed circuit boards with conductive metal." . . .

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