Saturday - July 5, 2025

Manifold Systems, Devices, and Methods for Thermal Management of Hardware Components

2025-06-03

ALEXANDRIA, Virginia, June 3 -- SEGUENTE, INC., Melbourne, Florida has been assigned a patent (No. US 12324131 B2, initially filed May 17, 2023) developed by three inventors Raffaele Luca Amalfi, Melbourne, Florida; Ryan Enright, Berkeley Heights, New Jersey; and John Kim, Bridgewater, New Jersey, for "Manifold systems, devices, and methods for thermal management of hardware components." . . .

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Manifold Systems, Devices, and Methods for Thermal Management of Hardware Components

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