Tuesday - April 7, 2026

Sensor Integrated Circuit With Integrated Coil and Element in Central Region of Mold Material

2023-06-13

ALEXANDRIA, Virginia, June 13 -- ALLEGRO MICROSYSTEMS, LLC, Manchester, New Hampshire has been assigned a patent (No. US 11677032 B2, initially filed June 14, 2022) developed by five inventors Ravi Vig, Concord, New Hampshire; William P. Taylor, Amherst, New Hampshire; Paul A. David, Bow, New Hampshire; P. Karl Scheller, Dover, New Hampshire; and Andreas P. Friedrich, Metz-Tessy, France, for "Sensor integrated circuit with integrated coil and element in central region of mold material." . . .

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Sensor Integrated Circuit With Integrated Coil and Element in Central Region of Mold Material

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