Innovation in Microelectromechanical Components Reduces Electronics Power Use
September 11, 2026
September 11, 2026
WRIGHT-PATTERSON AFB, Ohio, Sept. 11 -- Air Force Institute of Technology posted the following news:
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Innovation in Microelectromechanical Components Reduces Electronics Power Use
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A newly patented invention could provide the Department of the Air Force (DAF) with smaller, lighter, lower-power, and potentially lower-cost chip scale microelectromechanical components for aircraft, spacecraft, satellites, unmanned systems, and fielded electr . . .
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Innovation in Microelectromechanical Components Reduces Electronics Power Use
*
A newly patented invention could provide the Department of the Air Force (DAF) with smaller, lighter, lower-power, and potentially lower-cost chip scale microelectromechanical components for aircraft, spacecraft, satellites, unmanned systems, and fielded electr . . .