GlobalFoundries and RAAAM Memory Technologies Announce the Joint Development of Next-generation GCRAM Technology and Test Chip on FDX Platform
September 03, 2026
September 03, 2026
SANTA CLARA, California, Sept. 3 -- GlobalFoundries, a manufacturer of semiconductors, issued the following news release on Sept. 2, 2026:
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GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform
Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and u . . .
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GlobalFoundries and RAAAM Memory Technologies announce the joint development of next-generation GCRAM technology and test chip on FDX platform
Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and u . . .