Too thin to fail: an alternative to copper microchip interconnects
July 16, 2026
July 16, 2026
ITHACA, New York, July 16 -- Cornell University posted the following news:
* * *
Too thin to fail: an alternative to copper microchip interconnects
*
Electrical interconnects may very well be the unsung heroes of modern microchips.
These tiny wires - typically made of copper due to its high conductivity - string together the billions of transistors that drive our computers and electronic devices. But as the technology advances and . . .
* * *
Too thin to fail: an alternative to copper microchip interconnects
*
Electrical interconnects may very well be the unsung heroes of modern microchips.
These tiny wires - typically made of copper due to its high conductivity - string together the billions of transistors that drive our computers and electronic devices. But as the technology advances and . . .