MIT: Improving the performance of high-power electronics
June 08, 2026
June 08, 2026
CAMBRIDGE, Massachusetts, June 8 -- The Massachusetts Institute of Technology posted the following news:
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Improving the performance of high-power electronics
By using a thin layer of diamond to manage excessive heat, researchers can boost the speed and energy-efficiency of next-generation wireless devices.
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The silicon that forms the foundation of most computer chips has fundamental limits to how much power it can manage, wh . . .
* * *
Improving the performance of high-power electronics
By using a thin layer of diamond to manage excessive heat, researchers can boost the speed and energy-efficiency of next-generation wireless devices.
-
The silicon that forms the foundation of most computer chips has fundamental limits to how much power it can manage, wh . . .